What are the common professional terms for SMT surface mount processing that you must know?

Materials
17 Jun

1.SMA (Surface Mount Assembly) for SMT processing: printed circuit board assembly components assembled using surface mount technology.

2.Reflow soldering: the process of connecting surface mount components to PCB pads by melting the pre-distributed solder paste.

3.Wave soldering: the process of creating a wave of molten solder using specialized equipment to connect electronic components with PCB pads.

4.Fine pitch: pin spacing less than 0.5mm.

5.Pin co-planarity: the vertical height deviation of surface mount component pins, i.e. the perpendicular distance between the bottom of one pin and the plane formed by the bottom of all pins. Its value is generally no more than 0.1mm.

6.Solder paste: a mixture of powdered solder alloy, flux, and other additives that provide viscosity and rheological properties.

7.Curing: the process of heating the adhesive used to temporarily secure components to the PCB at a specific temperature and for a specific time.

8.Surface mount adhesive or red glue: an adhesive with some initial viscosity and shape before curing, and sufficient bonding strength after curing.

9.Dispensing: the process of applying surface mount adhesive to the PCB during assembly.

10.Dispenser: a device used for dispensing operations.

11.Placement: the process of picking up surface mount components from feeders and placing them in designated locations on the PCB.

12.SMT tape: a material used to connect feeders with SMT machines during assembly to save time and material costs without stopping the machine.

13.Pick-and-place machine: a specialized SMT machine that performs the function of placing surface mount components.

14.Hot air reflow soldering: reflow soldering performed using a forced circulation of hot air.

15.Inspection: quality inspection performed during or after surface mount assembly to check for missing, misaligned, or damaged components.

16.Stencil printing: the process of using a stainless steel plate to apply solder paste to PCB pads.

17.Automatic stencil cleaner: a device installed on a printer that automatically cleans excess solder paste during the printing process.

18.Printer: a specialized SMT machine used for stencil printing.

19.Post-reflow inspection: quality inspection performed on completed surface mount assemblies after reflow soldering or curing.

20.Pre-reflow inspection: quality inspection performed on surface mount assemblies before reflow soldering or curing.

21.Rework: the process of repairing localized defects on PCBA.

22.Rework station: a specialized device used for reworking PCBA with quality defects.

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